Another Sensor Leader (300007) Aims for Hong Kong IPO

At the start of 2026, the wave of domestic sensor companies listing in Hong Kong continues to gain momentum, with firms like豪威集团 and兆易创新 successfully going public on the Hong Kong Stock Exchange. Amid this industry trend, another major player has announced its entry. On the evening of January 16, Hanwei Technology Group Co., Ltd. (Stock Code: 300007.SZ), a leading domestic sensor company, issued an announcement stating that its board of directors had reviewed and approved a proposal to conduct an overseas public offering of H-shares and list on the Main Board of The Stock Exchange of Hong Kong Limited. Following the listing, the company will formally transition into an overseas-funded joint-stock company. This move marks the first-batch ChiNext-listed company’s formal launch of its “A+H” dual-market capitalization strategy, representing a crucial step toward its goal of becoming a global technology enterprise.

Since its establishment in 1998, Hanwei Technology has consistently focused on core sensor technologies, evolving into a renowned domestic provider of intelligent instrumentation and smart solutions. Leveraging its deep technical expertise, the company has developed a comprehensive product portfolio encompassing over 300 sensor types across 17 series, including semiconductor, catalytic combustion, MEMS, and flexible micro-nano sensors. These solutions deliver core sensing capabilities for the Internet of Things, industrial automation, and smart automotive sectors.

This push for a Hong Kong IPO represents a pivotal move in Hanwei Technology’s global strategy. According to the announcement, the company plans to publicly issue no more than 15% of its total post-issue share capital in H-shares, with the board authorized to grant underwriters an over-allotment option of up to 15% of the aforementioned issuance volume based on market conditions. Proceeds, net of issuance expenses, will be primarily allocated to core areas including establishing domestic and international R&D centers, investing in industrial chain acquisitions, expanding production bases and supply chains, and developing overseas marketing networks. Funds will also bolster working capital to fuel global expansion.

This IPO represents Hanwei Technology’s strategic groundwork to focus on core businesses and optimize industrial structure. Since 2025, the company has made significant strides: By divesting its heating business to streamline operations, the company concentrated resources on deepening its sensor expertise. It invested nearly RMB 28 million to acquire a controlling stake in Chongqing Staibao, entering the high-end temperature sensor market. Staibao’s thin-film platinum thermosensitive chips achieve internationally advanced performance, helping break foreign monopolies in this field. Concurrently, through its subsidiary Suzhou Nengsida, Hanwei is developing flexible micro-nano sensors to seize emerging opportunities like “electronic skin” for humanoid robots.

Hanwei Technology’s listing initiative represents both an inevitable strategic upgrade for the company and a precise alignment with the broader trend of sensor and semiconductor industry players seeking Hong Kong listings. This surge stems from the convergence of policy incentives, market advantages, and corporate demand: the China Securities Regulatory Commission has optimized the overseas listing filing mechanism, while the Hong Kong Stock Exchange provides institutional support through efficient review processes. Local governments have established listing “green channels,” offering comprehensive support for companies seeking Hong Kong listings. This enables enterprises to access global capital and enhance governance structures via the Hong Kong platform.

Currently, the global sensor market is entering a new growth cycle, with explosive demand from emerging fields like AI, smart vehicles, and humanoid robots opening vast opportunities for industry development. A research report by Shanxi Securities indicates that China’s humanoid robot market could reach a scale of ten trillion yuan, with core components like electronic skin experiencing sustained high-speed growth. Against this backdrop, Hanwei Technology, leveraging its technological strengths and industrial布局, combined with the empowerment of the Hong Kong listing platform, is poised to further consolidate its leading position domestically and accelerate its ascent among the global sensor industry’s top players.

To date, Hanwei Technology’s A-share market capitalization has reached RMB 19.2 billion, reflecting strong market recognition of its core business and globalization strategy. This push for a Hong Kong IPO marks not only a milestone in the company’s development but also sets a new benchmark for the internationalization of China’s sensor industry. Looking ahead, the establishment of an “A+H” dual-platform structure will position Hanwei Technology more advantageously in global sensor competition, paving the way for a new chapter in the globalization of China’s intelligent manufacturing.